Abstract
The hot deformation behavior of oxygen-free high-conductivity (OFHC) copper was studied through constitutive analysis by two distinct approaches, which consider the material parameters as apparent and physically based ones. The latter approach accounts for the dependence of the Young’s modulus and the self-diffusion coefficient on temperature, which can simply result in a reliable constitutive equation. It was shown that the theoretical exponent of 5 and the lattice self-diffusion activation energy of Cu (197 kJ mol^–1), corresponding to the glide and climb of dislocations as the controlling deformation mechanism, can be set in the hyperbolic sine law to describe the peak flow stresses. It has been also demonstrated that these two approaches are consistent with each other and the simple physically-based approach
described in this work can be considered as an alternative one for the conventional apparent approach.

Key words
thermomechanical processing, compression test, Zener-Hollomon parameter

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